Method for mounting electronic parts

Details Method for mounting electronic parts Method for mounting electronic parts

1987-09-11

1989-11-14

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 1562757, 1563071, 156320, B32B 3126, B32B 3128

Patent

active

048804860

ABSTRACT:
An adhesive containing at least two main components, and which is capable of being gelled to make it pressure-sensitive, of being photopolymerized and of being thermally polymerized, is applied at selected positions on a printed circuit substrate on which electronic parts are to be loaded. Ultraviolet rays are irradiated on the adhesive, to gelate the adhesive thereby to realize the pressure-sensitive adhesion ability by reaction of a photopolymerization functional group of the adhesive. After loading the electronic parts on the adhesive, the adhesive is hardened by reaction of a thermal polymerization functional group by heating. Thereafter, electrodes of the electronic parts and conductive lands of the printed circuit substrate are soldered.

REFERENCES:
patent: 4127432 (1978-11-01), Kuwano
patent: 4243500 (1981-01-01), Glennon
patent: 4311759 (1982-01-01), Glennon
patent: 4372802 (1983-02-01), Harigane
patent: 4720317 (1988-01-01), Kuroda

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