Composition and method for reducing copper oxide to metallic cop

Details Composition and method for reducing copper oxide to metallic cop Composition and method for reducing copper oxide to metallic cop

1996-04-03

1998-05-19

Bell, Janyce

Coating processes

Base supplied constituent

427328, 427327, 427444, 427299, B05D 500

Patent

active

057533091

ABSTRACT:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming members, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

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Akahoshi et al., New Copper Surface Treatment for Polyinride Multilayer Printed Wiring Boards, Circuit World 14(1) (1987), no month.
Hotachi, Ltd., Technical Publication: Chemical Reduction Treatment of Copper Oxide: DMAB Method (undated).

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