Socketing a semiconductor device

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Patent

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Details

Other Related Categories

206328, 439526, H01R 909, H01R 2372

Type

Patent

Status

active

Patent number

048803863

Description

ABSTRACT:
A film mounted semiconductor device is applied to a socket therefor by means of a protective carrier from which project four posts arranged in such a way that a line drawn between two opposite posts would pass through the center of the carrier. The film is formed with elongate slots each receiving one of the posts with clearance in the longitudinal direction of the slot but the post closely fitting the slot in its transverse direction. Each post is fitted snugly into a pocket in the socket. The slots allow relative movement between the film and the posts to take up dimensional changes resulting from temperature and humidity changes, but as the posts fit the slots in their transverse direction, the film, the carrier and the socket are maintained concentric.

REFERENCES:
patent: Re30604 (1981-05-01), Kowalski
patent: 4007479 (1977-02-01), Kowalski
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4684184 (1987-08-01), Grabbe et al.
patent: 4696526 (1987-09-01), Newton et al.
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4744009 (1988-05-01), Grabbe et al.
AMP Drawing Sheet Entitled "Ass'y Socket, High Speed".

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