Liquid or pasty thermosetting adhesive which can be pre-gelled a

Details Liquid or pasty thermosetting adhesive which can be pre-gelled a Liquid or pasty thermosetting adhesive which can be pre-gelled a

1980-10-29

1982-06-01

Schofer, Joseph L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

525110, 525119, 525120, 525113, 525423, 156330, 523464, C08K 501

Patent

active

043327133

ABSTRACT:
A liquid or pasty thermosetting adhesive which can be pre-gelled, which is suitable for the bonding of moulded parts or for the sealing of folded seams, and which contains (a) a liquid epoxide resin having on average more than one epoxide group in the molecule, and (b) a latent epoxide curing agent insoluble in the epoxide resin, the adhesive being characterized in that it also contains (c) in an amount of 5 to 50 percent by weight relative to the epoxide resin, at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which has a softening point of between 60.degree. and 160.degree. C., such as a polyethylene, a polypropylene or an ethylene/acrylic acid/acrylate terpolymer.

REFERENCES:
patent: 2713567 (1955-07-01), Scheibli
patent: 3371008 (1968-02-01), Lopez
patent: 3519576 (1970-07-01), Johnson
patent: 3530087 (1970-09-01), Hayes et al.
patent: 3634169 (1972-01-01), Garnish
patent: 3641195 (1972-02-01), Ball et al.
patent: 4112128 (1978-09-01), Fessler
patent: 4122128 (1978-10-01), Lehmann
CA, 49, 14344a (1955) (=AB)
CA, 52, 17813h (1958) (=AL)

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