Abrading – Abrading process – Glass or stone abrading
Patent
1997-10-17
2000-06-20
Morgan, Eileen P.
Abrading
Abrading process
Glass or stone abrading
451285, 451286, B24B 504
Patent
active
060771496
ABSTRACT:
In a surface-grinding method for a workpiece, for example a semiconductor wafer, it is possible to correct or improve waviness and bow and to obtain a semiconductor wafer having no thickness dispersion. Besides, wafer processing to higher precision than that conventionally attained is achieved and at the same time simplification of the processing method and thereby reduction of the cost are also achieved. In the present invention, while the workpiece is fixed for supporting at one surface by the fixedly supporting means of a surface-grinding apparatus, the other surface of the workpiece is surface-ground, where the workpiece adheres on the upper surface of a base plate by the aid of adhesive material and the base plate is fixedly supported by the lower surface of itself on the fixedly supporting means.
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Kato Tadahiro
Kudo Hideo
Ohkuni Sadayuki
Morgan Eileen P.
Shin-Etsu Handotai & Co., Ltd.
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