Chemical-mechanical polishing station with end-point monitoring

Details Chemical-mechanical polishing station with end-point monitoring Chemical-mechanical polishing station with end-point monitoring

1999-06-19

2000-06-20

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451288, B24B 4912, B24B 722

Patent

active

06077147&

ABSTRACT:
A chemical-mechanical polishing station for polishing wafers. The polishing station comprises a slurry supplier, a polishing pad capable of collecting the slurry, and a polishing head capable of rotating a wafer and lowering the wafer onto the polishing pad in contact with the polishing pad and the slurry during a polishing session. The polishing head further includes a retaining ring for positioning the wafer. The retaining ring houses a light-emitting device capable of shining a beam of light onto the slurry and a light sensor for picking up the beam of light reflected back from the slurry. The exact polishing end-point can be decided by analyzing signals obtained from the light sensor.

REFERENCES:
patent: 5643048 (1997-07-01), Iyer
patent: 5836805 (1998-11-01), Obeng
patent: 5851136 (1998-12-01), Lee

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