Printing apparatus and method of making mask pattern for exposur

Details Printing apparatus and method of making mask pattern for exposur Printing apparatus and method of making mask pattern for exposur

1997-11-24

2000-06-20

Hilten, John S.

Typewriting machines

Typing by other than type-face or type-die

Thermal

40012014, B41J 2315

Patent

active

060769815

ABSTRACT:
There are provided a printing apparatus and a method of making a mask pattern for exposure by the use of the printing apparatus. A temperature of a thermal head is detected, and a plurality of split pulses formed by dividing a strobe pulse applied to the thermal head are sequentially applied with quiescent periods interposed therebetween. There is stored in advance pulse-applying data of settings of a cumulative period of pulse-applying periods over which the plurality of split pulses are respectively applied, a number of the split pulses, the split pulse-applying periods, and the quiescent periods, defined in a manner corresponding to values of the temperature of the thermal head. Appropriate pulse-applying data is read out according to the temperature detected, and application of the split pulses is controlled according to the appropriate pulse-applying data. In another form, the split pulses are controlled in a manner such that the cumulative period of the split pulse-applying periods is sufficient for a time period over which the strobe pulse is required to be applied.

REFERENCES:
patent: 5741079 (1998-04-01), Hayama et al.

Affiliated with

Also associated with

Rating

Printing apparatus and method of making mask pattern for exposur does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printing apparatus and method of making mask pattern for exposur, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printing apparatus and method of making mask pattern for exposur will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1846493