Pseudo-electroless, followed by electroless, metallization of ni

Details Pseudo-electroless, followed by electroless, metallization of ni Pseudo-electroless, followed by electroless, metallization of ni

1991-12-17

1993-11-23

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Employing internal battery action during coating

205118, 205123, 205191, 205916, 427 97, 427305, C23C 2800

Patent

active

052641074

ABSTRACT:
A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.

REFERENCES:
patent: 4770751 (1988-09-01), Kawagishi et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Company, New York, 1978, pp. 389-391, 410-415.
Adams, A. C. et al., "High Density Interconnect for Advanced VLSI Packaging", Defect and Diffusion Forum, Proceedings of the ASM Symposium, Cincinnati, Ohio, Oct. 11-16, 1987, pp. 129-136, vol. 59 (1988).

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