Method of fixedly arranging an array of electroformed letters or

Details Method of fixedly arranging an array of electroformed letters or Method of fixedly arranging an array of electroformed letters or

1983-07-12

1984-07-31

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

C25D 120

Patent

active

044628730

ABSTRACT:
Fixedly arranging an array of electroformed letters or patterns on a product which includes the steps of forming a layer of resist on a metallic plate, electroforming letters, removing the electroformed letters from the plate with adhesive tape, coating each of the exposed surfaces of the electroformed letters with an adhesive, placing the electroformed letters and tape on the product and peeling the tape from the electroformed letters. The adhesive has an adhering power stronger than that of the adhesive tape so that the tape can be removed readily from the electroformed letters. The resist is applied to an area on the metallic plate except for the area occupied by the letters to be electroformed. The adhesive coated surface of the electroformed letters may be covered with protective paper.
To inhibit excessive electroforming along the periphery of the letters and minimize excessive application of the adhesive on the tape there are electroformed "sacrifice portions" adjacent the electroformed letters with a narrow layer of resist deposited therebetween. The sacrifice portions are removed from the tape after the adhesive agent is coated on each of the exposed surfaces of the letters and the sacrifice portions.

REFERENCES:
patent: 3414487 (1968-12-01), Helms
patent: 3998601 (1976-12-01), Yates
patent: 4053370 (1977-10-01), Yamashita

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