Strap spring for attaching heat sinks to circuit boards

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

24457, 248505, 257719, 361719, H05K 720

Patent

active

058479287

ABSTRACT:
A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

REFERENCES:
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patent: 4884331 (1989-12-01), Hinshaw
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patent: 5384940 (1995-01-01), Soule
patent: 5570271 (1996-10-01), Lavochkin
patent: 5581442 (1996-12-01), Morosas
patent: 5594624 (1997-01-01), Clemens
patent: 5602719 (1997-02-01), Kiniom
patent: 5617292 (1997-04-01), Steiner
patent: 5640305 (1997-06-01), Smithers
patent: 5668348 (1997-09-01), Lin
New Product Bulletin "Heat Sink For INTEL 80486 and 80860," (2 pages) 1989 Thermalloy, Inc.
Thermalloy Heat Sinks, pp. 1-6, Jun. 1991, Thermalloy, Inc.
TCM: Thermalloy Cooling Modules, Innovative TCM: High Performance Pin Fin Heat Sink With High Volume DC Fan Attached, (2 pages) Nov., 1991, Thermalloy, Inc.
Low Insertion Force (LIF) PGA Socket for Intel 486 DX2 CPU Device (Heat Sink Compatible), pp. 1-2, 1992, AMP Incorporated.

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