Wirebond removal apparatus using alternating fluid stream

Details Wirebond removal apparatus using alternating fluid stream Wirebond removal apparatus using alternating fluid stream

1992-02-28

1993-11-23

Jones, Eugenia

Severing by tearing or breaking

Methods

225 93, 225 97, 294264, 29762, 228264, 2281805, 239562, B26F 300

Patent

active

052636208

ABSTRACT:
A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

REFERENCES:
patent: 3390033 (1968-06-01), Brown
patent: 3460238 (1969-08-01), Christy et al.
patent: 4274576 (1981-06-01), Shariff
patent: 5152447 (1992-10-01), Wallgren et al.

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