Split conductive pad for mounting components to a circuit board

Details Split conductive pad for mounting components to a circuit board Split conductive pad for mounting components to a circuit board

1994-02-02

1995-06-20

Bishop, Steven C.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

361760, 361768, 361807, 361808, 361770, 439 78, 439876, H01R 909, H01R 402

Patent

active

054256470

ABSTRACT:
A component is mounted to a circuit board using two spaced apart conductive pad portions that make electrical contact with a terminal of the component. The space between the conductive pad portions provides an additional path through which a cleaning solution and debris can flow.

REFERENCES:
patent: 3770874 (1973-11-01), Krieger et al.
patent: 3778530 (1973-12-01), Reimann
patent: 4811081 (1989-03-01), Lyden
patent: 5089936 (1992-02-01), Kojima et al.
patent: 5206795 (1993-04-01), Belanger, Jr.
patent: 5249098 (1993-09-01), Rostoker et al.

Affiliated with

Also associated with

Rating

Split conductive pad for mounting components to a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Split conductive pad for mounting components to a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Split conductive pad for mounting components to a circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1840987