Abrading – Machine – Rotary tool
Patent
1995-09-18
1998-07-28
Rose, Robert A.
Abrading
Machine
Rotary tool
451 41, 451 56, 451443, 451444, 451446, 451285, 451286, 451287, 451289, B24B 500
Patent
active
057855854
ABSTRACT:
An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.
REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breigovel et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5527424 (1996-06-01), Mullins
patent: 5595527 (1997-01-01), Appel et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5626509 (1997-05-01), Hayashi
IBM Technical Disclosure Bulletin vol.37 No.04B Apr. 1994 Title: "Novel Pad Conditioning Technology for Polishing Wafers".
32227 "Pad Conditioning to Control Radial Uniformity of Mechanical Polishing" Reproduced from Research Disclosure, Feb. 1991, No. 322 c Kenneth Mason Publications Ltd, England.
Thin Solid Films, 220(1992)1-7 "Integration of Chemical-Mechanical Polishing Into CMOS Integrated Circuit Manufacturing" Howard Landis, et al. IBM Techology Products, Essex Junction, VT 05452(USA).
Bartley Richard Alan
Chamberlin Timothy Scott
Manfredi Paul Anthony
Morris Raymond George
International Business Machines - Corporation
Kotulak Richard M.
Nguyen George
Rose Robert A.
Walter, Jr. Howard J.
LandOfFree
Polish pad conditioner with radial compensation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polish pad conditioner with radial compensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polish pad conditioner with radial compensation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-18378