Hybrid thick film circuit device

Details Hybrid thick film circuit device Hybrid thick film circuit device

1987-09-08

1989-04-04

Edlow, Martin H.

357 51, 357 40, 357 74, 357 75, H01L 2702, H01L 2316

Patent

active

048190560

ABSTRACT:
A hybrid thick film chip device comprising two or more electrical components mounted in parallel on a single substrate and having common terminals for electrical interconnection to other devices or to circuit boards or the like. In one embodiment, the components comprise a resistor and a capacitor disposed on one surface of the substrate. In another embodiment the resistor is on one surface of the substrate and the capacitor is on the opposite surface. The device is particularly advantageous in forming networks.

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patent: 3555364 (1971-01-01), Matcovich
patent: 3560256 (1971-02-01), Abrams
patent: 3916434 (1975-10-01), Garboushian
patent: 4000054 (1976-12-01), Marcantonio
patent: 4123564 (1978-10-01), Ajima t al.
patent: 4454529 (1984-06-01), Philofsky et al.
patent: 4636918 (1987-01-01), Jodoin
patent: 4654694 (1987-03-01), Val

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