Method of producing infrared luminescent diodes

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148172, 148 335, 29580, 357 17, 156 17, 252 623GA, H01L 21208

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active

039986721

ABSTRACT:
A recess is formed in one of the principal surfaces of an N-type substrate of GaAs. Through the liquid phase growth technique, a silicon-doped N-type GaAs layer is formed on the one of the principal surfaces and on the surface of the recess and a silicon-doped P-type GaAs layer is continuously formed on the N-type GaAs layer. The liquid-phase-grown GaAs layers are so cut that the PN junction between the layers may be exposed on a plane.

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patent: 3849790 (1974-11-01), Gottsmann et al.

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