Printed circuit board with cavity for circuitization

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428901, 428131, 174255, B32B 300

Patent

active

060663863

ABSTRACT:
A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized dielectric layer and the sticker sheet each have a window which is registered with the other window forming a cavity. Next, a flexible release layer is laid above the second metallized dielectric layer and a thermosetting visco-plastic material is laid on the release layer over the cavity. Next the first and second metallized dielectric layers, sticker sheet, release layer and visco-plastic material are laminated by heat and pressure to cure the sticker sheet and thereby bind the first and second metallized dielectric sheets to each other. During the lamination step, the sticker sheet flows to the perimeter of the cavity. However, the pressure forces the visco-plastic material tightly into the cavity to seal a bottom perimeter of the cavity such that the sticker sheet forms a smooth fillet at the bottom perimeter of the cavity.

REFERENCES:
patent: 3840424 (1974-10-01), Morrison
patent: 4636275 (1987-01-01), Norell
patent: 4643935 (1987-02-01), McNeal et al.
patent: 4680075 (1987-07-01), McNeal et al.
patent: 4959008 (1990-09-01), Wasulko
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5288542 (1994-02-01), Cibulsky et al.
patent: 5346117 (1994-09-01), Kohn et al.
patent: 5925206 (1999-07-01), Boyko et al.

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