High sensitivity resist system for lift-off metallization

Details High sensitivity resist system for lift-off metallization High sensitivity resist system for lift-off metallization

1975-12-10

1977-05-17

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 44, 427273, 96 351, 96 362, 96115R, B05D 306

Patent

active

040242935

ABSTRACT:
High sensitivity resist films for lift-off metallization are formed by coating a substrate with at least two layers of polymeric materials, each layer of which is developed by different developers that are mutual exclusive of one another. The resist can operate for lift-off at electron beam exposure equal to or greater than 5.times.10.sup.-.sup.6 coulombs/cm.sup.2.

REFERENCES:
patent: 3799777 (1974-03-01), O'Keefe et al.
patent: 3930857 (1976-01-01), Bendz et al.
patent: 3934057 (1976-01-01), Moreau et al.
Chiv et al., "IBM Tech. Disc. Bull., July 1975, vol. 18, No. 2, p. 395.

Affiliated with

Also associated with

Rating

High sensitivity resist system for lift-off metallization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High sensitivity resist system for lift-off metallization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High sensitivity resist system for lift-off metallization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1835381