Method for filling contact holes with metal by two-step depositi

Details Method for filling contact holes with metal by two-step depositi Method for filling contact holes with metal by two-step depositi

1994-10-24

1997-11-04

Niebling, John

Fishing, trapping, and vermin destroying

437195, 437981, H01L 2128

Patent

active

056839383

ABSTRACT:
Method for filling contact holes with metals by two-step deposition of selective tungsten layer is disclosed. The selective tungsten thin films are deposited in two steps, thus maximizing the contact filling with tungsten, gaining a stability of metal wires with better step coverage, and enhancing the reliability on semiconductor element.

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