Method of fabricating trench isolation structure having tapered

Fishing – trapping – and vermin destroying

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1566441, 437947, 437981, H01L 2176

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056839081

ABSTRACT:
A device-isolating trench having a taper at its upper portion is formed in a silicon semiconductor substrate. Then, a silicon oxide film is formed on the inner wall of the trench and the surface of the semiconductor substrate near the trench by an oxidizing method, and polycrystalline silicon is buried in the trench.

REFERENCES:
patent: 4639288 (1987-01-01), Price et al.
patent: 4839306 (1989-06-01), Wakamatsu
patent: 4866004 (1989-09-01), Fukushima
patent: 4882291 (1989-11-01), Jeuch
patent: 4916086 (1990-04-01), Takaaashi et al.
patent: 4931409 (1990-06-01), Nakajima et al.
patent: 5100822 (1992-03-01), Mitani
patent: 5106770 (1992-04-01), Bulat
patent: 5258332 (1993-11-01), Horioka et al.
patent: 5506168 (1996-04-01), Morita et al.
Y. Tamaki et al., Evaluation of Dislocation Generation in U-Groove Isolation, Journal of the Electrochemical Society, vol. 135, No. 3, Mar. 1988, pp. 726-730.
A. Hayasaka et al., U-Groove Isilation Technique for High Speed Bipolar VLSI's, IEDM, 1982.
L.O. Wilson, Oxidation of Curved Silicon Surfaces, Journal of the Electrochemical Society, vol. 134, No. 2, pp. 481-490, Feb. 1987.
K. Imai et al., Decrease in Trenched Surface Oxide Leakage Currents By Rounding Off Oxidation, Japanese Journal of Applied Physics, Supplements 18th Conference on Solid State Devices, pp. 303-306, 1986.
Wolef, S. et al, Silicon Processing for the ULSI Era: vol. 1 Process Technology, 1986 Laltice Press, pp. 531-532.
Wolf, S., et al, Silicon Processing for the VLSI Era: vol. 1, Process Technology, Latice Press, 1986, p. 531.

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