Surface mounted integrated circuit chip package and method for m

Details Surface mounted integrated circuit chip package and method for m Surface mounted integrated circuit chip package and method for m

1983-12-30

1989-04-04

Sikes, William L.

H01L 3902

Patent

active

048190411

ABSTRACT:
A surface mountable integrated circuit chip package is taught. Briefly stated, a flexible laminate having conductive strips thereon is wrapped around a heat sink. Plastic is molded around the laminate-heat sink piece, with a window left in the center thereof, which coincides with a window in the laminate. An integrated circuit chip is then bonded to the heat sink with wire leads then run from the chip to the conductive strips on the laminate. A potting material is then placed in the window thereby completely encapsulating the integrated circuit chip so as to prevent exposure to environmental or physical damage. This thereby forms a package which is surface mountable to a circuit board through attachment techniques such as the vapor phase soldering.

REFERENCES:
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4215359 (1980-07-01), Schermer et al.
patent: 4218701 (1980-08-01), Shirasaki

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