Semiconductor device with surface mount package adapted for vert

Details Semiconductor device with surface mount package adapted for vert Semiconductor device with surface mount package adapted for vert

1994-03-22

1995-09-19

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257700, 257731, H01L 2348, H01L 2312

Patent

active

054518156

ABSTRACT:
A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on which the semiconductor element is placed. The stage has supporting members causing the semiconductor device to vertically stand on the circuit board. Wiring boards, stacked on a side of the stage on which the semiconductor element is placed, have windows in which the semiconductor element is located. The vertical placement part includes wiring lines extending between edges of the wiring boards facing the circuit board and peripheries of the windows. The wiring lines have ends located in the vicinity of the edges of the wiring boards and have a shape enabling the semiconductor device to be mounted on the circuit board.

REFERENCES:
patent: 5287000 (1994-02-01), Takahashi et al.
Patent Abstracts of Japan, vol. 12, No. 130 (E-603) 21 Apr. 1988 & JP-A-62 257 756 (NEC) 10 Nov. 1987.
Patent Abstracts of Japan, vol. 17, No. 13 (E-1304) 11 Jan. 1993 & JP-A-04 243 155 (NEC) 31 Aug. 1992.
Patent Abstracts of Japan, vol. 17, No. 128 (E-1333) 18 Mar. 1993 & JP-A-04 302 495 (Toshiba Lighting & Technol) 26 Oct. 1992.
U.S. Ser. No. 07/881,889 filed May 12, 1992 by Sono et al., assigned by Fujitsu Limited.

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