Method for cooling electronic devices using a flexible coolant c

Details Method for cooling electronic devices using a flexible coolant c Method for cooling electronic devices using a flexible coolant c

1999-01-19

2000-05-23

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29428, B23P 1526

Patent

active

06065208&

ABSTRACT:
To achieve the above-mentioned objects, and other related ones a method and apparatus for cooling of an electronic assembly is suggested. The electronic assembly is placed in thermal contact with a monolithic, non-jointed flexible coolant conduit housing a coolant. A plurality of cold plates are then slipped over the conduit, through their indentation like opening along a peripheral edge of each plate. The conduit with plates is then bend so as to complement the contour of the assembly to be cooled.

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Hodgson et al., "Cold Plate Vacuum Chuck for Cooling Printed Circuit Boards," Research Disclosure, No. 31491, (YO888-0769), Jun. 1990.
EG&G Wakefield Engineering Publication, Liquid Cooled Plates for Power Modules, Transistors and Diodes, Series 180-12, 180-20 and 180-26.

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