Low impedance packaging

Details Low impedance packaging Low impedance packaging

1989-06-09

1992-02-18

James, Andrew J.

357 70, H01L 2330, H01L 2348

Patent

active

050898787

ABSTRACT:
A package for an integrated circuit is disclosed. The package includes a lead frame with an overlying dielectric layer. One or more conductive coupons are placed on the dielectric layer and act as multiple inductive paths for the power and ground lines. Decoupling capacitors may be attached between coupons.

REFERENCES:
patent: 4543544 (1985-09-01), Ziegner
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4594641 (1986-06-01), Hernandez
patent: 4638348 (1987-01-01), Brown et al.
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4680617 (1987-07-01), Ross
patent: 4731700 (1988-03-01), Woodward et al.
patent: 4744007 (1988-05-01), Watari et al.
patent: 4754366 (1988-06-01), Hernandez
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4801765 (1989-01-01), Moyer et al.
patent: 4827327 (1989-05-01), Miyauchi et al.
patent: 4827377 (1989-05-01), Butt
patent: 4839717 (1989-06-01), Phy et al.
patent: 4891687 (1990-01-01), Mallik et al.
"Ground Plane for an A-Tab Package", IBM T.D.B., vol. 30, No. 12, May/88, pp. 176-177.
Holz, "Next-Generation High-Speed Packaging", MSN & CT, (1988), 18:32-40.
Hyslop et al., "High Performance Decoupling Capacitor for Installation Under the Dual-In-Line IC Package", 1987, Proceedings of the 37th Electronic Components Conference, (Cat. No. 87CH2448-9), (May 1987), pp. 499-455.
Biswas, "A New Concept in Decoupling I.C. Devices", Sixteenth Annual Connectors and Interconnection Technology Symposium Proceedings, (Nov. 1983), pp. 203-219.
Intel Corporation, "Multi-Layer Molded High Performance PQFP", 3, Technical Papers, dated 04/27/89, 04/27/89 and 05/24/89, respectively.

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