Solder interconnection structure and process for making

Details Solder interconnection structure and process for making Solder interconnection structure and process for making

Filed on

1990-12-10

Date issued

1992-02-18

Examiner

Chaudhuri, Olik

Patent Class

Fishing, trapping, and vermin destroying

Other Related Categories

437211, H01L 2350

Type

Patent

Status

active

Patent number

050894404

Description

ABSTRACT:
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

REFERENCES:
patent: 3949125 (1976-04-01), Roberts
patent: 4504283 (1985-03-01), Charwat
patent: 4579806 (1986-04-01), Schupp et al.
patent: 4604644 (1986-08-01), Beckham et al.
Chemical Abstracts, vol. 82, No. 164236a, (1975).

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