Process for producing evaporated gold films

Details Process for producing evaporated gold films Process for producing evaporated gold films

1978-03-10

1979-03-27

Robinson, Ellis P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427125, 427126, 427404, 427419R, 428469, 428472, 428432, 428917, 428539, G02F 117

Patent

active

041463099

ABSTRACT:
A process is described for producing devices with gold films on surfaces composed of certain inorganic fluoride compounds. An adhesion compound such as lead fluoride, cadmium fluoride or tin fluoride or mixtures of these compounds is interspersed between inorganic fluoride surface and gold film. This process is particularly attractive for the fabrication of electrochromic display devices and solid-state switches. This procedure insures good adhesion of gold film to inorganic fluoride and insures high reliability in the manufacture of such devices. In addition, electrodes made in accordance with the invention have highly desirable electrical characteristics including ohmic resistance characteristics and low electrode resistances.

REFERENCES:
patent: RE28199 (1974-10-01), Deb
patent: 2750832 (1956-06-01), Morgan
patent: 2915153 (1959-12-01), Hitchcock
patent: 3463663 (1969-08-01), Chopra
patent: 3578843 (1971-05-01), Castellion
patent: 3630603 (1971-12-01), Lotter
patent: 3829196 (1974-08-01), Deb
patent: 3840286 (1974-10-01), Kiss
patent: 4004057 (1977-01-01), Hoffman

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