Method of connecting surface mounted packages to a circuit board

Details Method of connecting surface mounted packages to a circuit board Method of connecting surface mounted packages to a circuit board

1980-10-26

1983-11-22

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29832, 29834, 361381, 361403, 361406, H05K 118

Patent

active

044172966

ABSTRACT:
A method (and the resulting article) comprises the step of providing a surface mounted package connector including a thermal buffer pad. Preferably the surface mounted package is mounted on a circuit board having preselected circuitry thereon. The present method provides a mounting capable of withstanding severe temperature cycling and thermal shocks.

REFERENCES:
patent: 3141998 (1964-07-01), Silkman
patent: 3259804 (1966-07-01), Parstorfer
patent: 3311790 (1967-03-01), Vizzier
patent: 3346773 (1967-10-01), Lomerson
patent: 3495023 (1970-02-01), Hessinger
patent: 3591839 (1971-07-01), Evans
patent: 3621112 (1971-11-01), Stickely
patent: 4195195 (1980-03-01), Miranda
S. K. Wadha, Low-Cost Circuit Packaging, IBM, Tech. Disc. Bull., V. 22 #2, Jul. 1979, p. 522.
W. B. Archey, Water Cooling Plate for Card on Board Packages, IBM Tach. Discl. Bull., vol. 19 #2, Jul. 1976, p. 412 & 413.
E. Berndlmaier, Chip Perimeter Cooling Band, IBM Tech. Discl. Bull., vol. 21 #11 Apr. 1979, p. 4483 & 4484.

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