Method of positioning a thin semiconductor plate and patterns to

Photocopying – Projection printing and copying cameras – Step and repeat

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355 77, G03B 2742, G03B 2732

Patent

active

041726561

ABSTRACT:
The method consists in recording at least one reference mark on each of the patterns corresponding to the various levels of the circuit at a fixed point, in recording the reference mark of the first pattern in the semiconductor plate at the same time as the first pattern and then, after each positioning of the thin plate after the chemical treatments, in centering, by displacing the thin plate relative to the pattern, the images in the plane of the following pattern of at least two reference marks situated in the different zones with the complementary reference mark carried by the following pattern to be projected, the thin plate then being aligned with the following pattern to be projected.

REFERENCES:
patent: 3476476 (1969-11-01), Chitayat
patent: 3602591 (1971-08-01), Bouwer et al.
patent: 3838274 (1974-09-01), Doubek et al.
patent: 3844655 (1974-10-01), Johannsmeier
I.B.M. Technical Disclosure Bulletin, vol. 7, No. 4, Sep. 1964, pp. 329-330.

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