Multi-chip module, an electronic device, and production method t

Details Multi-chip module, an electronic device, and production method t Multi-chip module, an electronic device, and production method t

1998-01-20

1999-09-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361818, 361765, 361783, 361767, 361807, 361810, 257723, 257724, 257700, 257704, 257774, H05K 0118, H01L 2500

Patent

active

059496541

ABSTRACT:
A substantially lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having a substantially lead-free electrode is face-down mounted on the first surface. A substantially lead-free bump is formed on the substantially lead-free electrode of an electronic element. Mounting pads and substantially lead-free bumps are electrically and mechanically connected to each other by substantially lead-free conductive resin. A substantially lead-free sealing pattern is formed at the area which encloses the electronic element mounted area, of the first surface of the substrate. A weld ring made of Kovar is brazed onto the sealing pattern with substantially lead-free solder. The opening edge of a sealing cap made of Kovar disposed opposite to the weld ring and the weld ring are bonded at the deposited zone by welding.

REFERENCES:
patent: 5153709 (1992-10-01), Fukuoka
patent: 5414300 (1995-05-01), Tozawa et al.
patent: 5473512 (1995-12-01), Degani et al.
patent: 5477009 (1995-12-01), Brendecke et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 5818699 (1998-10-01), Fukuoka

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