Circuit pack cooling using perforations

Details Circuit pack cooling using perforations Circuit pack cooling using perforations

1990-06-25

1992-06-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H05H 720

Patent

active

051212900

ABSTRACT:
Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.

REFERENCES:
patent: 2187011 (1940-01-01), Braden
patent: 3967874 (1976-07-01), Calabro
patent: 4393437 (1983-07-01), Bell et al.
patent: 4399484 (1983-08-01), Mayer
patent: 4408255 (1983-10-01), Adkins
patent: 4839774 (1989-06-01), Hamburgen
patent: 4851965 (1989-07-01), Gabuzda et al.

Affiliated with

Also associated with

Rating

Circuit pack cooling using perforations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit pack cooling using perforations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit pack cooling using perforations will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1809633