Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1995-11-07
1998-12-08
Zarabian, A.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, H01L 2348
Patent
active
058474552
ABSTRACT:
A ball grid array (BGA) package configuration for packaging an integrated-circuit die includes a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad. The bonding fingers are disposed peripherally surrounding the die-attach pad. An integrated-circuit die is mounted on the die-attach pad. Bonding fingers are interconnected between the bonding pads on the integrated-circuit die and the plurality of bonding fingers. A plastic material is molded over the top of the lead frame and the die while still providing an exposed bottom surface of the bonding fingers on the lead frame. A solder mask is disposed over the bottom of the lead frame so as to form selective solder areas. Solder balls are attached to the selective solder areas.
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"High Performance Package" Product Announcement by Olin Interconnect Technologies, Manteca, California, pp. 146-152.
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King Patrick T.
VLSI Technology Inc.
Zarabian A.
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