Method for testing interconnects and semiconductor dice

Details Method for testing interconnects and semiconductor dice Method for testing interconnects and semiconductor dice

1997-07-08

1999-09-07

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

059492414

ABSTRACT:
A method for testing an interconnect for a bare semiconductor die is provided. The method includes: assembling the interconnect and die in a temporary package; applying a bias voltage between a conductor and a substrate of the interconnect; and then detecting leakage current from the conductor to the substrate or to another conductor. A current sensing circuit makes an electrical connection with each conductor and with the substrate for the interconnect. The current sensing circuit then applies a bias voltage to the conductors and detects any resultant leakage current. The electrical connection with the substrate can be with a spring loaded connector operating through a hole in a base of the temporary package, or with a conductive member formed on the temporary package in electrical communication with a dedicated external lead.

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