Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1998-04-03
1999-09-07
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257676, 257686, 257666, H01L 25065, H01L 23525, H01L 2708
Patent
active
059491396
ABSTRACT:
This is provided a dual-surface mounting type semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power. In the dual-surface mounting type semiconductor integrated circuit device, a specified circuit for implementing a function common to integrated circuit chips and mounted on both surfaces of a chip mounting section of a lead frame is provided only for the integrated circuit chip of one surface, and an output signal of the specified circuit provided only for the integrated circuit chip of this one surface is transmitted to the integrated circuit chip of the other surface via bonding wires and an internal lead.
REFERENCES:
patent: 5391917 (1995-02-01), Gilmour et al.
Imura Koji
Komatsu Koji
Tatsukawa Masaaki
Brown Peter Toby
Duong Hung Van
Sharp Kabushiki Kaisha
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