Shaped riser on substrate step for promoting metal film continui

Details Shaped riser on substrate step for promoting metal film continui Shaped riser on substrate step for promoting metal film continui

1974-06-03

1976-08-31

James, Andrew J.

357 23, 357 52, 357 68, H01L 2348, H01L 2940, H01L 2978, H01L 2944

Patent

active

RE0289523

ABSTRACT:
In integrated circuit devices which have insulating coatings with portions of different thickness bounded by relatively high steps and deposited metal conductors on the coatings, yield losses often result from breaks in the metal conductors at the steps. By shaping the insulator step with an offset wherever a metal crossing is required, the probability of such breaks is reduced.

REFERENCES:
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patent: 3339128 (1967-08-01), Olmstead et al.
patent: 3374406 (1968-03-01), Wallmark
patent: 3528168 (1970-09-01), Adamic
patent: 3688389 (1972-09-01), Nakanuma et al.
patent: 3739237 (1973-06-01), Shannon
patent: 3761785 (1973-09-01), Pruniaux
patent: 3859717 (1975-01-01), Green

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