Metal working – Method of mechanical manufacture – Electrical device making
Patent
1974-10-16
1976-01-27
Lanham, C. W.
Metal working
Method of mechanical manufacture
Electrical device making
96 362, 174 685, 317101B, 427 96, H05K 318, H05K 328
Patent
active
039343359
ABSTRACT:
Multilayer printed circuit board is fabricated by coating a suitable substrate, metal, plastic, paper, with a photosensitive coating, exposing the photosensitive coating to form a dielectric thereof, coating the dielectric layer with a coating of a photosensitive chemical solution, selectively imaging and developing the photosensitive coating to form a desired circuit pattern on the dielectric coating, forming a first layer of circuitry by coating the circuit pattern with a conducting material, coating the circuitry bearing layer with a second layer of photosensitive material, selectively exposing and developing the second layer of photosensitive material to form a dielectric with open windows to the first circuit layer, coating the second dielectric layer of the first circuitry with a coating of photosensitive chemical solution, selectively imaging and developing the coating of photosensitive chemical solution to form a circuit pattern and an interconnect pattern and forming a conductor layer of circuitry and interconnects, the interconnect metallization connecting the second circuitry layer with the first circuitry layer, repeating the process to form additional circuitry layers to perform a desired electrical function and forming on the last dielectric layer a metallization such as either a solder mask for circuit terminals or a ground plane and thereafter either retaining the substrate if desired for, for example, a heat sink or additional support or both, or removing the substrate to form a very light weight multilayer printed circuit board.
REFERENCES:
patent: 3366519 (1968-01-01), Pritchard et al.
patent: 3525617 (1970-08-01), Bingham
patent: 3540954 (1970-11-01), Pritchard et al.
patent: 3622384 (1971-11-01), Davey et al.
patent: 3628999 (1971-12-01), Schneble et al.
patent: 3666549 (1972-05-01), Rhodenizer et al.
patent: 3679941 (1972-07-01), Lacombe et al.
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 3745095 (1973-07-01), Chadwick et al.
patent: 3846166 (1974-11-01), Saiki et al.
Bandy Alva H.
Grossman Rene E.
Lanham C. W.
Levine Harold
Texas Instruments Incorporated
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