Process for curing epoxy encapsulant on integrated circuit dice

Details Process for curing epoxy encapsulant on integrated circuit dice Process for curing epoxy encapsulant on integrated circuit dice

1988-03-30

1989-04-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437217, 29827, 29829, 206330, 206332, 357 70, 26427213, H01L 2302

Patent

active

048187267

ABSTRACT:
The present invention provides a method for protecting integrated circuit packages mounted on carrier tapes during manufacturing steps commonly employed in tape automated bonding processes. A reel is provided for winding the carrier tape into a compact package. A steel tape with corrugated longitudinal edges is also provided for winding on the reel in alternating layers with the carrier tape. The carrier tape thus is framed, layer by layer, with the steel tape, thus protecting each integrated circuit package from coming into contact with another object during manufacturing steps, e.g. heat curing.

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J. N. Lesyk, "Protecting Components on Carrier Tape", Technical Digest, No. 54, Apr. 1979, pp. 17-18.

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