Method of fabricating electrical components in high density subs

Details Method of fabricating electrical components in high density subs Method of fabricating electrical components in high density subs

1990-10-30

1992-06-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437918, 437919, 148DIG14, 148DIG136, H01L 2170

Patent

active

051205726

ABSTRACT:
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be connected selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for cooper/polyimide substrates.

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