Semiconductor device having improved lead attachment

Details Semiconductor device having improved lead attachment Semiconductor device having improved lead attachment

1982-08-30

1985-05-07

James, Andrew J.

357 26, 357 55, 357 80, 357 65, H01L 2160, H01L 2144

Patent

active

045161488

ABSTRACT:
Improved contacts to a semiconductor device such as a plural substrate pressure sensor are provided by forming recessed contact regions along the periphery of a semiconductor substrate and interconnecting the contact regions with an internal circuit. A second, glass substrate encapsulates the circuit and covers the recessed contact regions thereby defining tunnels in the edges of the device. A pre-tinned wire can be inserted into a tunnel and solder bonded to a metal layer therein, thereby forming a single and rugged lead attachment.

REFERENCES:
patent: 3231797 (1966-01-01), Koch
patent: 3614678 (1971-10-01), Engeler et al.
patent: 3641254 (1972-02-01), Bunting et al.
patent: 3793709 (1974-02-01), Baumann
patent: 4127863 (1978-11-01), Kurata
patent: 4286374 (1981-12-01), Hantusch
patent: 4353082 (1982-10-01), Chatterjee
patent: 4374457 (1983-02-01), Weich, Jr.
patent: 4379307 (1983-04-01), Soclof

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