Multi-layered tungsten depositions for contact hole filling

Details Multi-layered tungsten depositions for contact hole filling Multi-layered tungsten depositions for contact hole filling

1996-06-21

1997-12-23

Quach, T. N.

Fishing, trapping, and vermin destroying

437648, 437672, 437738, H01L 21283, H01L 213065

Patent

active

057007268

ABSTRACT:
A process for filling small diameter contact holes, with tungsten, has been developed. This process consists of using two consecutive tungsten depositions. A first tungsten layer, that will exhibit a fast removal rate in a specific dry etch chemistry, such as RIE, is used to coat the sidewalls of the small diameter contact hole. Next a second layer of tungsten, that will exhibit a significantly slower removal rate then the first tungsten layer, is used to completely fill the contact hole. Etchback, to remove unwanted material from areas outside the contact hole, does not significantly attack the second tungsten fill, in the contact hole, thus not aggravating any seams in the second tungsten fill that may have been created during the LPCVD tungsten, contact hole fill process.

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