Low profile, thermally set wrapped cover for a percutaneously de

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156247, 606192, 606194, 606195, 623 1, 623 11, 623 12, B32B 3100, A61M 2900, A61F 206, A61F 202

Patent

active

059481919

ABSTRACT:
An endoprosthesis assembly for percutaneous deployment on a balloon catheter is disclosed. The assembly includes a radially expandable stent overlied by a tubular, low profile stent cover wrapped over the stent. The wrapped cover is thermally set to maintain its low profile wrapped configuration during deployment of the assembly. At the treatment site, the balloon portion of the catheter is inflated causing the stent to expand radially and the stent cover to unwrap and open to conform to the expanded configuration of the stent.

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