Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-08-16
1994-11-01
Desmond, Eugene F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, 439487, H01R 448
Patent
active
053603486
ABSTRACT:
A test socket for testing of semiconductor devices. The socket includes a plurality of electrical contacts mounted within a housing, a cover, and a pressure applicator which serve to prolong test life of the contacts. The pressure applicator is mounted to the cover by use of an elastomeric element which compliantly holds the applicator to the cover. The socket construction, thereby, serves to prevent damage to leads of an integrated circuit device held by the socket.
REFERENCES:
patent: 4758176 (1988-07-01), Abe et al.
patent: 5100332 (1992-03-01), Egawa
patent: 5266037 (1993-11-01), Hetzel et al.
Desmond Eugene F.
JohnsTech International Corporation
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