Electrochemical treatment of copper for improving its bond stren

Details Electrochemical treatment of copper for improving its bond stren Electrochemical treatment of copper for improving its bond stren

1984-01-30

1985-05-07

Andrews, R. L.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204DIG9, C25D 1700

Patent

active

045156719

ABSTRACT:
A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.

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