High pressure condensation soldering, fusing or brazing

Metal fusion bonding – Process – Preplacing solid filler

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Details

34 34, 34231, 134182, 432194, B23K 300, F27D 702

Patent

active

043736580

ABSTRACT:
A high pressure steam condensation soldering facility (10) is described. The facility (10) incorporates a chamber (12) having a centrally located heat processing zone (45) into which high pressure steam is injected to reflow solder on articles (43) therein. A baffle (41) having a conical top portion (51) with a plurality of apertures (52) therein permits controlled amounts of the steam to pass therethrough while redirecting a portion of the steam along the wall (16) of the chamber (12) to interpose a shield of steam between the wall and uniformly heated processing zone (45).

REFERENCES:
patent: 918335 (1909-04-01), Lain
patent: 1821943 (1931-09-01), McClatchie
patent: 2897778 (1959-08-01), Held et al.
patent: 3343477 (1967-09-01), Ekstam
patent: 3543776 (1970-12-01), Layton
patent: 3866307 (1975-02-01), Pfahl, Jr.
patent: 4253247 (1981-03-01), Bergstrom

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