Method of manufacturing three dimensional integrated circuits

Details Method of manufacturing three dimensional integrated circuits Method of manufacturing three dimensional integrated circuits

1977-01-24

1978-10-03

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29602R, 29625, 264 61, 336200, 336233, 361397, H01F 4102

Patent

active

041175883

ABSTRACT:
A method of manufacturing three dimensional integrated circuits from compatible co-fireable materials by extruding batched co-fireable materials to form blocks of specified cross-sections, selecting and stacking cross-section of various widths from different blocks in a specified manner to form the desired circuit and placing the stack in a furnace having a predetermined temperature time profile to properly sinter each of the materials.

REFERENCES:
patent: 3322871 (1967-05-01), Noack et al.
patent: 3325881 (1967-06-01), Engelking
patent: 3852877 (1974-12-01), Ahn et al.
patent: 3948706 (1976-04-01), Schmeckenbecher
"Laminated Memory Construction with Discrete Ferrite Memory Elements", RCA ech. Notes No. 664, Nov. 1965 by Drukaroff et al.
"Sliced Laminate, Printed Circuit Interconnections", IBM Tech. Disclosure Bull., vol. 10, No. 11, Apr. 1968, by Peter et al.

Affiliated with

Also associated with

Rating

Method of manufacturing three dimensional integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing three dimensional integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing three dimensional integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1795075