Method for preparation of multi-layer structure film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 451, 4272481, 427249, 427255, 4272551, 4272557, 437225, B05D 306, C23C 1622

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active

048185604

ABSTRACT:
A method for preparing a multi-layer structure film by forming a deposited film according to the chemical vapor depostion method comprises introducing a subjective starting material gas (A) which is the major flow rate component and an objective starting material gas (B) which is the minor flow rate component and hydrogen externally activated into a reaction space and controlling periodically the amount of said objective starting material gas (B) introduced to thereby form a deposited film with a multi-layer structure.

REFERENCES:
patent: 3473978 (1969-10-01), Jackson et al.
patent: 3825439 (1974-07-01), Tick
patent: 3916034 (1975-10-01), Tsuchimoto
patent: 4077818 (1978-03-01), Chu
patent: 4084024 (1978-04-01), Schumacher
patent: 4217374 (1980-08-01), Ovshinsky et al.
patent: 4220488 (1980-09-01), Duchemin et al.
patent: 4282267 (1981-08-01), Kuyel
patent: 4402762 (1983-09-01), John et al.
patent: 4410559 (1983-10-01), Hamakawa et al.
patent: 4419381 (1983-12-01), Yamazaki
patent: 4430185 (1984-02-01), Shimomoto et al.
patent: 4434188 (1984-02-01), Kamo et al.
patent: 4439463 (1984-03-01), Miller
patent: 4448801 (1984-05-01), Fukuda et al.
patent: 4450185 (1984-05-01), Shimizu et al.
patent: 4461783 (1984-07-01), Yamazaki
patent: 4466992 (1984-08-01), Dreiling
patent: 4468413 (1984-08-01), Bachmann
patent: 4468443 (1984-08-01), Shimizu et al.
patent: 4471042 (1984-09-01), Komatsu et al.
patent: 4485125 (1984-11-01), Izu et al.
patent: 4504518 (1985-03-01), Ovshinsky et al.
patent: 4514437 (1985-04-01), Nath
patent: 4517223 (1985-05-01), Ovshinsky et al.
patent: 4521447 (1985-06-01), Ovshinsky et al.
patent: 4522663 (1985-06-01), Ovshinsky et al.
patent: 4526805 (1985-07-01), Yashizawa
patent: 4532199 (1985-07-01), Ueno et al.
patent: 4539934 (1985-09-01), Fujiyama et al.
patent: 4543267 (1985-09-01), Yamazaki
patent: 4544423 (1985-10-01), Tsuge et al.
patent: 4546008 (1985-10-01), Saitoh et al.
patent: 4554180 (1985-11-01), Hirooka
patent: 4564533 (1986-01-01), Yamazaki
patent: 4564997 (1986-01-01), Matsuo et al.
patent: 4567127 (1986-01-01), Saitoh et al.
patent: 4569697 (1986-02-01), Tsu et al.
patent: 4582560 (1986-04-01), Sanjurjo
patent: 4615905 (1986-10-01), Ovshinsky et al.
patent: 4657777 (1987-04-01), Hirooka
patent: 4664937 (1987-05-01), Ovshinsky et al.
patent: 4683145 (1987-07-01), Nishimura et al.
patent: 4689093 (1987-08-01), Ishihara et al.
Brodsky, et al., 22 IBM Technical Disclosure Bulletin 3391 (Jan. 1980).
Janai, et al., 52 J. Appl. Phys. 3622 (May 1981).

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