Thermally matched mounting substrate

Details Thermally matched mounting substrate Thermally matched mounting substrate

1985-03-11

1987-03-17

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 357 74, H01L 2314

Patent

active

046509224

ABSTRACT:
A mounting substrate (10) is formed from a platelet of graphite (22) conformally coated with a layer of silicon carbide (24). A layer of silicon dioxide (25) is disposed thereon and a chip (16) mounted onto the substrate (10). The silicon carbide has a thermal expansion coefficient that is essentially equal to silicon in addition to a high thermal conductivity.

REFERENCES:
patent: 3391016 (1968-07-01), McCrary, Jr. et al.
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4283464 (1981-08-01), Hascoe
patent: 4370421 (1983-01-01), Matsushita et al.
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4581279 (1986-04-01), Sugishita et al.

Affiliated with

Also associated with

Rating

Thermally matched mounting substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally matched mounting substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally matched mounting substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1789407