Structure and method for mounting semiconductor device

Details Structure and method for mounting semiconductor device Structure and method for mounting semiconductor device

1992-12-16

1994-11-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361743, 361750, 361767, 174 521, 174138G, 257779, 257783, H05K 702

Patent

active

053632770

ABSTRACT:
The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in opposition to and connected to each other, the wiring pattern 2 is connected to the projection electrodes 5 while penetrated through an adhesive and thermosetting thin film member 3 covering the wiring pattern 2; and the integrated circuit 4 is held onto the circuit substrate 1 by a hardening force of the adhesive and thermosetting thin film member 3.

REFERENCES:
patent: 5225966 (1993-07-01), Basavanhally

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