Apparatus for covering electronic components with plastic materi

Details Apparatus for covering electronic components with plastic materi Apparatus for covering electronic components with plastic materi

1976-06-16

1979-01-09

Husar, Francis S.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425122, 425126R, 425129R, 425229, 425575, 425453, B29F 110

Patent

active

041336216

ABSTRACT:
A machine for covering electronic components with a low-pressure molding compound while said components are carried by a strip comprises a closing unit assembly, which is rotatable on an axis of rotation and comprises two angularly spaced apart, C-shaped closing sub units, each of which has an open side remote from said axis of rotation and comprises mold means and is operable to open and close said mold means. Each of said closing sub-units is operable to a first position, in which its mold means are adapted to enclose electronic components carried by a strip and to receive said molding compound to cover said components, and to a second position, in which its mold means are open. Said closing unit assembly is operable to move said closing sub-units in alternation to said first position and to move each closing sub-unit to said second position while moving the other closing sub-unit to said first position. The machine further comprises cleaning means operable to clean said mold means of each of said closing sub-units when the same is in said second position.

REFERENCES:
patent: 3571920 (1971-03-01), Berg
patent: 3577610 (1971-05-01), Margolin et al.
patent: 3730665 (1973-05-01), Fortin et al.
patent: 3907472 (1975-09-01), Lutsey
patent: 3918864 (1975-11-01), Braun
patent: 3973888 (1976-08-01), Hehl

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