Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-04-26
1998-02-17
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257717, 257712, 361676, 361688, H01L 2334, H02B 100, H01R 6368
Patent
active
057194440
ABSTRACT:
A packaging and cooling system for one or more semi-conductor devices provides a casement defining a die chamber carrying a peripherally positioned power board with pre-attached multi-functional power pins communicating to medially positioned dies. The power pins provide not only improved power supply but also provide heat transfer from and mechanical support for the die. The die with an attached power supply plane and heat spreader is flip mounted on the power pins. The casement defines channels for coolant between the power board and dies and outwardly of the heat spreader. A closed cooling system provides a fluidic coolant to an input plenum from which it is sprayed into the die chamber channels for evaporative cooling therein on both sides of contained dies and about the power pins with subsequent recovery and recycling. The asymmetrical architecture within the die chamber allows less restricted thermal expansion of the various components than would result from common symmetrical architecture.
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Smetana Bruce A.
Tilton Charles L.
Tilton Donald E.
Bergman Keith S.
Clark Jhihan B.
Saadat Mahshid D.
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