Process for manufacturing a plural stacked leadframe semiconduct

Fishing – trapping – and vermin destroying

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437220, 26427217, H01L 2156, H01L 2158, H01L 2160

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active

055696252

ABSTRACT:
A semiconductor process includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.

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