Image sensor having a multi-layered printed circuit board with i

Details Image sensor having a multi-layered printed circuit board with i Image sensor having a multi-layered printed circuit board with i

1995-06-01

1996-10-29

Powell, William

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

216 17, 216 20, 216 13, 361736, 437180, B44C 122, C23F 100

Patent

active

055693903

ABSTRACT:
A multi-layered printed circuit board forms a base of a sensor board. Sensor chips are mounted on the multi-layered printed circuit board. The multi-layered printed circuit board is composed of a substrate, a first conductor layer, an internal insulator layer, a second conductor layer, and a surface insulator layer. An analog ground line is formed of the electrolytic copper foil of the first conductor layer by chemical etching. A signal line is formed of the electrolytic copper foil of the second conductor layer by chemical etching. Insulator layers are formed between the first conductor layer and the second conductor layer to generate a distributed capacitance between the signal line and the analog ground line for filtering out noise and improving performance.

REFERENCES:
patent: 3499218 (1970-03-01), Dahlgren et al.
patent: 4281208 (1981-07-01), Kuwano et al.
patent: 5041187 (1991-08-01), Hink et al.
"Multilayer Printed Wiring Board by Veer Sheet System", (Abstract) Conference & Exhibition, 23rd Internepcon Japan 94, Jan. 27, 1994, Masuo Matumoto.
"Multilayer Silver Paste Wiring Board and Manufacturing Engineering" & 1 Sheet of Drawing Figures (Figs. 1 & 2), Jisso Gijitu, 1994, Masuo Matumoto .

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